Publications

(2025). Capacitance Sensor Array Chip with Programmable Fusion Pixels, Sampling Device Thereof and Controlling System Thereof. Taiwan Patent 113118659 (Issued), US Patent 18/668,308 (Reviewing), Japan Patent 2024-081458 (Reviewing).

(2025). Programmable Dielectrophoretic Semiconductor Chip, Packaging Structure and Control System Thereof. Taiwan Patent 113124980 (Issued), US Patent 18/762,720 (Reviewing), Japan Patent 2024-107133 (Reviewing).