Programmable Dielectrophoretic Semiconductor Chip, Packaging Structure and Control System Thereof

Chen-Yi Lee, Wen-Yue Lin, Lin-Hung Lai
April 2025
Type
Patent
Publication
Taiwan Patent 113124980 (Issued), US Patent 18/762,720 (Reviewing), Japan Patent 2024-107133 (Reviewing)
CSA Capacitive Sensor Fusion Pixel Lab-on-Chip CMOS
Lin-Hung Lai
Lin-Hung Lai
Visiting Student Researcher @ Stanford University

My research interests include distributed robotics, mobile computing and programmable matter.